05
May
Ardentec’s Longtan plant is set to begin taking AI ASIC wafer-probing orders in the third quarter of 2026, as the semiconductor testing provider moves to capture spillover demand from foundry strategic partners.
05
May
European delegation meets Taiwan industry to bolster counter-drone cooperation
A European delegation’s closed-door talks with Taiwanese industry on counter-drone systems highlight accelerating global security implications as drone warfare evolves rapidly, informed by combat lessons from Ukraine and the Middle East; increased drone proliferation is driving urgent demand for multinational cooperation in technology, strategy, and logistics globally.
05
May
Google’s TPU push hits Nvidia’s neocloud grip
Google’s effort to expand its tensor processing units (TPU) beyond its own cloud is meeting resistance from some of the AI infrastructure companies best positioned to distribute alternative chips, with executives from Nebius, Lambda, and CoreWeave saying they do not plan to adopt TPUs anytime soon, according to The Information.
05
May
AI and chips propel US back to top of Taiwan’s trade chart
Trade between Taiwan and the US reached US$78.25 billion in the first quarter of 2026, driven primarily by advanced node chips and AI servers. This marks the first time in 25 years that the US has surpassed China and Hong Kong to retake its place as Taiwan’s largest trading partner. Moreover, Minister of Economic Affairs Ming-hsin Kung has forecast 7% GDP growth for 2026, following 8.68% growth in 2025.
05
May
AMI capacity sold out through 2028 as CCL makers race for high-end tools
The PCB industry is entering a new phase of transformation in the AI era, as rising demand for high-frequency and high-speed applications accelerates upgrades in upstream copper-clad laminate (CCL) materials. Among the beneficiaries is impregnation equipment maker Asia Metal Industries (AMI).
05
May
TCL reportedly in talks to sell majority stake in India display plant
China’s TCL Electronics is reportedly in advanced discussions to sell a majority stake in its Indian display manufacturing business. The move underscores accelerating localization pressure on foreign electronics firms in India and the ongoing restructuring of Chinese supply chain presence in the country.
05
May
Another Qualcomm exec joins Intel to lead PC and physical AI unit
Intel has announced that it has appointed Alex Katouzian as head of its Client Computing and Physical AI Division. With this hire, Intel seeks to align its consumer PC business with physical AI applications spanning robotics and AI -enabled devices.
05
May
As Nvidia goes to zero in China, Beijing races to fill the void
Nvidia CEO Jensen Huang said the company’s share of China’s data-center computing market has dropped to zero. The admission underscores how US export controls are reshaping the country’s AI chip sector — and how urgently Beijing is moving to localize its semiconductor supply chain, from processors to silicon wafers.
05
May
Memory crunch widens Apple-Android AP divide; agentic AI eyed as next catalyst
DIGITIMES Research has released its latest forecast for smartphone application processor (AP) shipments, revealing a divergence between Apple and the Android ecosystem as the market enters a seasonal slowdown. While weaker demand is typically expected across the board, recent data suggests a clear split in performance between the two camps.
05
May
SEMICON SEA 2026: the trillion-dollar chip era is already here
The global semiconductor industry is entering a “multi-trillion-dollar” growth cycle sooner than expected, SEMI President and CEO Ajit Manocha said, urging Southeast Asian countries to strengthen cooperation to address talent, energy, and geopolitical challenges. Manocha predicted rapid revenue expansion driven by AI, IoT, and quantum demand.