Qualcomm cloud AI ASIC business strategy
Qualcomm advances from edge to cloud AI ASIC, challenging the existing cloud computing power supply chain landscape.
05
Jan
05
Jan
Taiwanese network equipment suppliers ramp up investments as shift to 800G and 1.6T standards proceeds
Driven by surging demand for AI and cloud data centers, the network equipment industry is rapidly advancing from 400G to 800G and beyond to 1.6T specifications. This technological leap is prompting structural changes across connectors, cabling, cooling systems, optical communications, and overall system architectures, marking a new phase in the development of high-performance computing.
05
Jan
Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demand
Chunghwa Precision Test Tech (CHPT), a subsidiary of Chunghwa Telecom, plans to start construction of its third Pingzhen plant in Taoyuan in early 2026, with completion expected by early 2028. Production could begin in the second half of 2028, supporting the company’s medium- to long-term capacity expansion in the semiconductor sector.
05
Jan
Etron Technology to showcase edge AI memory and robotics platforms at CES 2026
Etron Technology is concentrating its edge AI strategy on four pillars: memory, intelligent vision sensing, high-speed transmission, and privacy computing. Under the theme “MemorAiLink show up,” the company will present its edge AI portfolio at CES 2026, targeting AI and robotics growth opportunities.
05
Jan
Black Sesame’s Huashan A2000 clears US Commerce, Defense reviews, secures global sales approval
Black Sesame Technologies has secured a rare regulatory breakthrough for a China-based automotive AI chip developer. On January 4, 2025, the company said its high-performance Huashan A2000 intelligent driving SoC had cleared reviews by the US Department of Commerce and the US Department of Defense, allowing global sales and deployment. The decision effectively moves the A2000 into large-scale commercialization, an outcome few peers have achieved under current regulatory conditions.
05
Jan
Ericsson highlights Taiwan’s CPE and RF edge ahead of 6G rollout
The global mobile communication standard is rapidly advancing toward 6G. Facing the next-generation technology race, Ericsson Taiwan president David Chou noted that Taiwanese manufacturers hold advantageous positions in customer premises equipment (CPE) and chip supply chains. However, he advised Taiwan to accelerate its transition to a standalone (SA) 5G network architecture to prepare for future developments.
05
Jan
Inpaq CEO Pei-Jen Chen launches resource realignment plan
Inpaq Technology, a passive components maker under the Walsin Technology Group, has launched an internal resource realignment plan. Newly appointed CEO and president Pei-Jen Chen stated that the company is emphasizing shortening time to market by integrating sites and centralizing development to build flexible capacity allocation capabilities. Inpaq intends to launch new products every month in 2026.
05
Jan
TSMC kicks off 2nm production with Samsung in hot pursuit
The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as the two chipmakers vie for leadership at the industry’s most advanced manufacturing node. The move is closely watched across the semiconductor sector because 2nm technology is expected to underpin the next generation of AI, mobile, and high-performance computing chips, shaping pricing power, customer relationships, and supply-chain diversification.
05
Jan
Geopolitics-driven auto industry reshuffling on display at CES 2026
Geopolitically driven supply-chain realignment is pushing the global auto industry into a critical moment of risk diversification. An emerging industrial bloc centered on “non-China” supply chains is beginning to take shape, reshaping how automakers and technology companies source, build, and deploy vehicles.
05
Jan
Samsung bets on smart driving, testing old alliances
Samsung Electronics’ decision to acquire a major advanced driver-assistance systems (ADAS) business through its subsidiary Harman is widely viewed as a decisive escalation of its ambitions in automotive electronics. Yet the move is also stirring unease among industry observers, who warn that it could complicate Samsung’s long-standing partnership with Hyundai Motor Group, raising questions about how the two South Korean giants will navigate an increasingly crowded and competitive automotive technology market.