Jensen Huang arrived in Seoul on June 5 for what looked like a replay of his Taiwan trip — meetings with Samsung Electronics, SK Hynix, LG Group and Hyundai Motor Group, all companies whose strengths in HBM, advanced packaging, autonomous driving, robotics and smart factories are increasingly tied to Nvidia’s future. But his first stop was none of them.

Jensen Huang wrapped up his Taiwan run at GTC Taipei and Computex 2026 and flew to South Korea on June 5. His first stop was not Samsung or SK Hynix. It was Hongdae, where he met T1 star Faker — Lee Sang-hyeok — co-signed an RTX 5090 graphics card, and immediately set the internet on fire.

As artificial intelligence (AI) drives demand for more powerful computing systems and smarter machines, Taiwanese optics manufacturer Ability Opto-Electronics Technology is positioning itself at the intersection of two emerging technology frontiers: metalenses and optical interconnects.

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin’s Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin’s Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status sensing, and anomaly detection on the equipment side.