30
Oct
OpenAI is reportedly gearing up to launch an initial public offering (IPO), potentially valued at US$1 trillion, aiming for a public listing by late 2026 or early 2027. According to Reuters and WSJ, insider sources reveal the company’s initial fundraising valuation could start at US$60 billion, positioning OpenAI among the largest tech IPOs in history.
30
Oct
Singapore leverages advanced packaging to capture share of US$1 trillion chip market
Terence Gan, Executive Director of Singapore’s Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling Singapore’s ambition to become a global center for advanced semiconductor packaging research and commercialization as artificial intelligence reshapes the industry.
30
Oct
STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips
Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company’s advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging as one of the fastest-growing areas in the semiconductor industry.
30
Oct
‘Semiconductor paradox’ defines next chip boom, says director of Singapore’s SSIA
Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging Developers Conference (APDC) that the industry must strengthen collaboration and local networks to navigate geopolitical and resource challenges as it moves toward a projected US$1 trillion market by 2030.
30
Oct
Analysis: Japan’s new PM aims to replicate TSMC playbook with tech investment push
Japan’s new Prime Minister Sanae Takaichi announced a growth strategy prioritizing “crisis management investment” in AI, semiconductors, and quantum technology to address economic and security risks. Key officials have been appointed to lead these efforts.
30
Oct
TPSC unveils Taiwan’s largest perovskite solar window
Taiwan Perovskite Solar Corp. (TPSC) demonstrated its full vertical integration across materials, processes, modules, equipment, and applications at Energy Taiwan 2025 under the theme “Perovskite NEXT: Linking the Future?EPerovskite.” Collaborating with 14 partners from Taiwan and the US, the company highlighted the accelerating development and maturing landscape of Taiwan’s perovskite solar ecosystem.
30
Oct
Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute
Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi’s HBM TC Bonder core technology of infringing its patents.
30
Oct
Microsoft’s AI engine accelerates with record growth and expanding partnerships
Microsoft kicked off its 2026 fiscal year with another blockbuster quarter. First quarter fiscal 2026 revenue reached US$77.7 billion, up 18% year-over-year, while operating income surged 24% and earnings per share climbed 23% to US$4.13. The company’s AI-driven momentum continued to build, with Microsoft Cloud revenue up 26% to US$49.1 billion, reflecting both unprecedented demand and a deepening integration of generative AI across its ecosystem.
30
Oct
蓝思科技第三季度归母净利润同比上升12.6%
10月28日,蓝思科技(300433)公布2025年三季报,公司营业收入为536.6亿元,同比上升16.1%;归母净利润为28.4亿元,同比上升19.9%;扣非归母净利润为27.0亿元,同比上升28.7%;经营现金流净额为58.44亿元,同比下降7.1%;EPS(全面摊薄)为0.538元。
30
Oct
LGD第三季度营业利润为4310亿韩元,扭亏为盈
10月30日, LG Display(LGD)于今日宣布,2025年第三季度合并基准的营收为6兆9570亿韩元,营业利润为4310亿韩元,同比增长2%,营业利润成功实现扭亏为盈。