15
Oct
On October 14, 2025, L&T Semiconductor Technologies (LTSCT) announced a long-term partnership with Foxconn subsidiary Hon Young Semiconductor (HYS) to jointly develop and manufacture high-voltage semiconductor wafers ranging from 650V to 3,300V. The collaboration aims to address growing global demand for efficient and reliable power components used in electrification platforms across automotive and industrial applications.
15
Oct
Carmax upgrades car system with Garmin collaboration
Taiwan-based Hotai Group has partnered with global satellite navigation and smart wearable brand Garmin to launch an upgraded version of the Drive+ Link intelligent in-car system. As smart vehicle technology advances, car infotainment systems have evolved beyond navigation and entertainment to become indispensable smart assistants during driving.
15
Oct
China Mobile to fully adopt domestic AI chips by 2028
China Mobile announced at its global partner conference in Guangzhou that it plans to exclusively use domestically produced chips across the country’s largest artificial intelligence (AI) computing network by 2028. The move seeks to accelerate AI autonomy and reduce reliance on foreign technology amid growing geopolitical tensions.
15
Oct
Semiconductor material distributors post strong revenue growth from AI and HPC demand
Several semiconductor materials distributors have posted robust revenue growth, reflecting rising demand driven by advancements in artificial intelligence (AI) and high-performance computing (HPC).
15
Oct
LGES posts stronger-than-expected 3Q25 operating profit as energy storage growth offsets EV demand drop
LG Energy Solution (LGES) reported preliminary financial results for the third quarter of 2025, posting an operating profit of KRW 601.3 billion (approx. US$423 million), up 34.1% year-over-year and surpassing market expectations. Despite reduced customer demand following the US removal of electric vehicle (EV) tax credits, LGES’s expanding energy storage system (ESS) business successfully offset the impact.
15
Oct
Samsung ramps up semiconductor talent hiring in India amid global AI design push
South Korean chipmaker Samsung Electronics is stepping up efforts to secure engineering talent in India, reinforcing the country’s growing role as a global hub for semiconductor design and innovation.
15
Oct
OCP Summit: Axiado teams up with Jabil to deliver AI-driven security for OCP modular servers
Axiado Corporation, a pioneer in AI-powered, hardware-based platform security and system management, has announced a strategic collaboration with Jabil, a global leader in engineering, supply chain, and manufacturing solutions. Together, they are developing AI-enhanced cybersecurity and Modular Hardware System (MHS) server solutions aligned with the Open Compute Project (OCP). These next-generation products, designed for advanced AI and cloud workloads, are showcased at the OCP Global Summit, taking place from October 13 to 16, 2025, at booths A1 (Axiado) and C12 (Jabil).
15
Oct
Korea’s TV giants confront crisis as Chinese competitors rise and consumer habits shift
The golden age of TV in South Korea is fading fast. Once the indispensable centerpiece of every home, the TV is now fighting for relevance as younger viewers turn to their smartphones and streaming services for entertainment. Korean electronics giants Samsung and LG are now fighting a two-front war: a cultural shift away from traditional viewing at home and a relentless market assault from surging Chinese competitors.
15
Oct
Global server shipment forecast, 2026 and beyond
The global server shipments are projected to have a CAGR of approximately 5% from 2025 to 2030, with AI demand driving technological innovation.
15
Oct
OCP Summit: Arm redefines AI infrastructure with open chiplet collab
At the OCP Global Summit 2025, Arm’s Mohamed Awad, Senior Vice President and General Manager of Infrastructure Business, delivered a keynote urging the data center industry to rethink how systems are built in the age of AI. His talk, titled “What AI Wants: New Silicon, New Systems, and a New Era for the Data Center,” highlighted that performance-per-watt optimization, ecosystem collaboration, and custom silicon are key to meeting the explosive growth in AI workloads.