OCP Summit: Foxconn Interconnect Technology showcases high-speed and cooling innovations

Foxconn Interconnect Technology (FIT) unveiled its latest high-speed interconnect and thermal management solutions aimed at enhancing 224G generation transmission and energy efficiency at the 2025 Open Compute Project (OCP) Global Summit in San Jose, the US. The exhibition highlighted FIT’s efforts to address rising power consumption challenges in high-performance computing (HPC) and data centers.

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Subsidiary of China’s SiCarrier launches home-grown EDA software at SEMiBAY 2025

Qiyunfang, a subsidiary of SiCarrier, officially released two domestically developed Electronic Design Automation (EDA) software products at the SEMiBAY 2025 event on October 15. The announcement represents a major advancement for China’s efforts to achieve technological independence in EDA design software, a critical area in semiconductor manufacturing.

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TCL华星牵头制定!《电竞显示器技术要求》行业标准正式发布

近日,由TCL华星牵头制定的《电竞显示器技术要求》(SJ/T 12019-2025)行业标准,经中华人民共和国工业和信息化部公告发布(2025年第19号)。该标准由全国音频、视频及多媒体系统与设备标准化技术委员会(SAC/TC242)归口,联合中国电子技术标准化研究院、联想、小米、泰瑞特检测等显示行业企业共同编制,首次为电竞显示器产品建立系统的技术规范体系。

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