China’s development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles, including high process complexity, reliance on imported equipment, cost-yield balance issues, fragmented supply chains, patent barriers dominated by Japan, South Korea, and the US, and long research and development cycles.

Taiwanese PC maker Asustek Computer is expanding its footprint beyond India’s metropolitan markets as it looks to double its device sales to as many as two million units by 2030. The company, which ranks as India’s third-largest consumer notebook brand, is focusing on non-metro and Tier-III towns to tap into first-time PC buyers, while simultaneously strengthening its local manufacturing and product lineup in gaming and AI-driven notebooks, according to Money Control and Mint.

Phoenix Silicon International (PSI) has officially launched the expansion of its Zhonggang FAB3A/B manufacturing complex, announcing plans for the new FAB3B plant to begin production in 2028. The facility aims to significantly increase the company’s wafer output beyond the current capacity of 600,000 wafers per month.