India aims to deepen semiconductor supply chain through Taiwan collab and domestic investment

At the recent “Taiwan-India Semiconductor Forum” held during SEMICON Taiwan 2025, the India Taipei Association (ITA) highlighted significant developments in India’s semiconductor sector. Amitesh Sinha, CEO of the India Semiconductor Mission (ISM), disclosed that the joint venture between India’s HCL Group and Taiwan’s Hon Hai Precision Industry (Foxconn) has become the sixth project approved for subsidies under India’s semiconductor initiative. India plans to expand its semiconductor capabilities, not only in silicon chip production but also in compound semiconductor research and manufacturing, with investments ongoing across various segments, including printed circuit boards, packaging, testing, and materials.

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India accelerates chip ambitions with record investments and tight deadlines

India, traditionally seen as a global hub for IT services, exports second only to the US, is now shifting focus towards becoming a significant player in semiconductor manufacturing. On September 2, during the SEMICON India 2025 forum, Prime Minister Narendra Modi announced an accelerated timeline for India’s semiconductor industry development plan, aiming to mass-produce its first chip by the end of 2025.

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诚志股份董事会换届延期

​9月29日消息,诚志股份(000990)公告,诚志股份有限公司(以下简称“公司”)第八届董事会、监事会将于2025年9月29日任期届满。由于公司换届选举、配套管理制度修订以及监事会改革等相关工作正在筹备中,为保证董事会、监事会工作的连续性及稳定性,公司董事会换届选举工作将适当延期,公司董事会、董事会各专门委员会、高级管理人员的任期相应顺延,监事会任期亦相应顺延。

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莱宝高科:董事王行村辞职

​9月26日晚间,莱宝高科发布公告称,2025年9月26日,深圳莱宝高科技股份有限公司(以下简称“公司”)董事会收到董事、副总经理、董事会秘书王行村先生的《辞职报告》,王行村先生因公司治理结构调整,提请辞去公司董事(非独立董事)职务,辞职后,仍在公司继续担任副总经理、董事会秘书职务。

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