Inpaq expects PC/notebook upgrade momentum to continue; CEO says component price hikes are inevitable

Passive components maker Inpaq, under Passive System Alliance (PSA), held its annual investor conference. Looking ahead, CEO Eunice Chen expects 2025 orders driven by the PC/notebook (PC/NB) replacement cycle to be much stronger than supply chain forecasts, pushing utilization rates above 90%. She is optimistic that this strong order momentum will extend into 2026, becoming a key driver for steady growth in antenna product shipments.

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China’s Univista rides domestic EDA surge to push for IPO

Univista Industrial Software Group filed for initial public offering guidance on December 26, seeking capital to support the development of domestic semiconductor design tools in China. The Shanghai-based company submitted its filing to the Shanghai Securities Regulatory Bureau with Guotai Haitong Securities serving as the sponsor, according to a report by Sina Finance.

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Top tech topics in 2025 (1): a year of strategic realignment for global semiconductors

As 2025 draws to a close, the global semiconductor industry has undergone a fundamental transformation marked by heightened geopolitical tensions, supply chain restructuring, and an unprecedented surge in AI-driven demand. What distinguishes this year from previous cycles is the shift from aspirational roadmaps to hard-edged execution, where manufacturers must deliver not just technological advancement but reliable, scalable production under increasingly complex constraints.

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TSMC’s Arizona red tape exposes reality of reshoring US manufacturing

TSMC’s Arizona semiconductor complex illustrates the practical hurdles of re-shoring advanced manufacturing to the US. The project required navigating 18,000 unique rules and permits, revealing regulatory complexity, labor shortages, and cultural friction that highlight the challenges facing American ambitions to regain leadership in high-tech industrial production.

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South Korea charts road to 0.2nm chips by 2040

The global semiconductor industry is poised to enter the “angstrom era” by 2040 as circuit dimensions shrink to one-tenth of current levels, according to a long-term technology roadmap from the Korean Institute of Semiconductor Engineers. The report suggests that transistor dimensions will push far beyond today’s nm scale, forcing fundamental shifts in chip design as traditional scaling reaches its physical limits.

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