Samsung reportedly struggles with HBM4 yields as SK Hynix leads memory race

Samsung is betting on advanced 1c DRAM-based HBM4 technology but remains constrained by 35% yields, while SK Hynix relies on stable production and Nvidia’s trust to defend its lead. As Nvidia readies its Vera Rubin AI platform and tests cheaper GDDR7 alternatives, the rivalry between Korea’s memory giants is reshaping the high-value market heading into 2026.

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Huawei declares supernode era to eclipse Nvidia within 2 years

At Huawei Connect 2025, the company rolled out a three-year roadmap for its Ascend chips alongside the debut of its Atlas 950 supernode. Rotating chairman Eric Xu warned that China’s AI future can no longer hinge on single-chip performance, constrained as it is by advanced process limits. The way forward, he argued, is a “supernode + cluster” architecture — Huawei’s bet on system-level design to secure scalable and sustainable compute.

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Tesla reportedly recruiting semiconductor talent to boost AI6 chip and 2nm Samsung collaboration

Tesla is actively recruiting semiconductor experts to enhance its next-generation chip development and mass production capabilities. Recent reports indicate that Samsung Electronics’ foundry division secured the wafer fabrication order for Tesla’s “AI6” chip. Consequently, this recruitment drive likely aims to improve AI6 yield rates and strengthen cooperation with Samsung.

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