07
Nov
07
Nov
LG wins multiple CES 2026 Innovation Awards
07
Nov
Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026
Hanmi Semiconductor announced it will release a dedicated device called the “Wide TC Bonder” by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM). Industry sources expect this equipment to be officially adopted starting with the eighth-generation HBM5.
07
Nov
AWS pledges US$9 billion for AI expansion in South Korea, eyeing agentic AI leadership
Amazon Web Services (AWS) CEO Matt Garman has announced an additional US$5 billion investment in South Korea, bringing AWS’s total commitment to US$9 billion to expand AI data centers. Garman highlighted South Korea as a prime market for AI innovation and positioned AWS as a key “AI innovation partner” for local enterprises, expressing particular optimism about the development of agentic AI.
07
Nov
BOE ramps up 8.6-gen OLED mass production to challenge SDC
China’s leading display manufacturer, BOE, is accelerating its deployment of 8.6-generation OLED production. The first phase of investment is nearly complete, and the company is preparing for the second phase of equipment procurement. By speeding up its investment timeline, BOE is positioning itself to catch up with Samsung Display (SDC) and potentially challenge its market dominance in the OLED sector.
07
Nov
Trump’s trade policies trigger Taiwan’s US$400 billion US investment surge
Amid US President Donald Trump’s tariff threats and new incentives under the US “One Big Beautiful Bill Act,” foreign companies are increasingly planning major investments in the US. Japan aims to invest US$550 billion, South Korea US$350 billion, Malaysia US$70 billion, and Taiwan reportedly plans US$400 billion, though trade and diplomatic officials have not confirmed the latter figure.
07
Nov
ASE unveils AI-enhanced IDE 2.0 to accelerate chip design and packaging
ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations and optimize chip-package interaction (CPI) analysis. The improvement aims to enhance the deployment of AI and high-performance computing applications by shortening development timelines.
07
Nov
Automotive lenses drive growth for optical companies
End-market performance is expected to reflect improving demand for automotive chips in the second to third quarters of 2026. The optical industry has benefited significantly, with companies including CALIN, Asia Optical (AO), and Canon focusing on automotive lenses.
07
Nov
Foxconn expects 4Q25 growth as AI servers, ICT products drive demand
Leading electronics contract manufacturer Hon Hai Precision Industry (Foxconn) reported October 2025 revenue of NT$895.71 billion (US$28.99 billion), up 7% sequentially and 11.29% year over year, driven by the continued AI boom and peak season for smartphone shipments. The company’s cumulative revenue for January to October 2025 reached NT$6.39 trillion, marking a 15.55% increase compared to the NT$5.53 trillion in the same period of 2024.
07
Nov
CHT Security posts record revenue, profit in 3Q25 with growth across three key margins
Taiwanese cybersecurity firm CHT Security announced its operational results for the third quarter of 2025 on November 5. Both revenue and profit reached new highs, with quarterly revenue up 6% year-over-year to NT$490 million (approx. US$15.86 million).