China’s self-sufficiency agenda spurs JPT’s leap into optical inspection

Shenzhen JPT Opto-Electronics, a well-established name in China’s laser industry, is expanding into optical inspection as Beijing’s push for supply chain localization gains momentum. Having entered the photonic inspection field in 2016, the company now sees strong growth potential as China prioritizes self-sufficiency in advanced manufacturing.

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China’s Lightstar targets record localization in optical passive components amid tariff pressures

China’s drive for technology self-sufficiency is transforming the communications supply chain. Shenzhen-based Lightstar Technology expects localization of advanced optical passive components to reach record levels within the next five to ten years, with imports of specialty materials giving way to domestically produced alternatives as Beijing’s push for homegrown innovation accelerates.

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SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar

At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company’s OSAT technology development, laid out a stark assessment of the semiconductor industry’s next bottleneck: the energy cost of scaling AI. He warned that the exponential rise in AI model parameters—growing at an estimated 20-fold annually—is pushing module size, power use, and I/O bandwidth toward unsustainable levels.

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SEMICON Taiwan 2025: Mirle debuts humanoid robot, targeting semiconductor smart manufacturing

A new player has joined Taiwan’s humanoid robot supply chain, with leading automation system supplier Mirle teaming up with food giant I-Mei Foods and controller maker Syntec to form a new joint venture targeting the unmanned vehicle market. Their self-developed humanoid robot made its debut at SEMICON Taiwan 2025, serving as a prelude to future operations that will expand into robot dogs and drones.

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SEMICON Taiwan 2025: CHPT enters US CSP supply chain; order visibility extends to 3Q26

Taiwanese test interface manufacturer CHPT showcased its latest innovations at SEMICON Taiwan 2025. Besides unveiling a comprehensive upgrade solution centered on “AI-driven probe card technology,” President Scott Huang highlighted the technical challenges that advanced process chips—such as mobile application processors (AP) and high-performance computing (HPC) chips used in AI applications—pose to the IC testing supply chain.

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