Renowned chip architect Jim Keller was invited to speak at the SEMICON Taiwan 2025 Master Forum. At the start of his speech, Keller announced that his company, Tenstorrent, will establish an office in Taipei and openly recruit talented individuals interested in joining the team.

Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced semiconductor assembly and test services (OSATs) such as ASE Holdings and Powertech Technology (PTI) are actively advancing their capabilities.

Sunny Optical Technology (Group) Company, a major supplier in the global optics supply chain, featured prominently at this year’s China International Optoelectronic Exposition (CIOE), the industry’s flagship trade show. With smart glasses and Apple’s upcoming launches drawing renewed headlines, Sunny Optical has returned to the center of market attention.

In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking an unprecedented scale compared to earlier initiatives. National Science and Technology Council (NSTC) minister Cheng-Wen Wu stated that the Taiwan CbI program will comprehensively strengthen the global competitiveness and resilience of Taiwan’s semiconductor industry supply chain.