天马前董事长彭旭辉担任洛阳钼业CEO
10月25日，洛阳钼业（603993.SH）发布高管任命公告，聘任彭旭辉为公司总裁兼CEO，并推荐作为执行董事候选人，原总裁孙瑞文离职并辞任执行董事。这是继今年4月聘任新奥能源原执行总裁刘建锋担任董事长兼首席投资官、紫金矿业原副总裁阙朝阳担任首席运营官兼副总裁、新希望六和原财务负责人陈兴垚担任CFO之后，洛阳钼业又一次迎来重要人事变动。
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Oct
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Oct
TSMC’s Cliff Hou calls for a stronger Taiwan chip ecosystem to turn crisis into advantage
The Taiwan Semiconductor Industry Association (TSIA) held its annual meeting on October 23. Chairman and Taiwan Semiconductor Manufacturing Company (TSMC) senior vice president and co-COO Cliff Hou emphasized that despite the challenges and changes in 2025, Taiwan’s semiconductor industry continues to demonstrate strong resilience, adding that Taiwan’s manufacturing sector remains a global leader, while its IC design output holds steady as the world’s second largest.
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Oct
India roundup: Tie-up with Dixon marks renewed Taiwanese investments in India’s EMS
Dixon’s joint venture with Taiwan-based Inventec is expected to operate after April 2026, as the Indian EMS major reports surging sales thanks to handset manufacturing business.
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Oct
As Huawei stumbles, ByteDance quietly rewrites China’s AI cloud order
Huawei Cloud CEO Zhang Ping’an and several top executives were recently demoted and had their salaries reduced, officially due to “performance falsification.” The punishment, however, reflects a broader shift in the AI era: the inseparable link between large models, AI applications, and AI infrastructure. ByteDance’s Volcengine has emerged as a key disruptor representing this integrated vision in China’s cloud ecosystem.
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Oct
Taiwan firm turns to smart server locks as AI data centers demand tighter security
Electronic component distributor WFE Technology is set to list on the Taipei Exchange (TPEx) in mid-to-late November 2025, positioning itself to benefit from rising cybersecurity and environmental monitoring standards for data centers and AI servers.
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Oct
LGES approaches China’s battery market with time compression, accumulation strategy
In the face of policy and capital competition pressure from Chinese companies, LG Energy Solution (LGES) is implementing a strategy that combines time compression and accumulation. The “compression” of time refers to AI and digital transformation, while the “accumulation” of time refers to differentiated technology and patents.
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Oct
CXMT, Huawei align on HBM3 ahead of China’s 2026 AI memory leap
High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China’s CXMT has reportedly delivered 16nm HBM3 samples to Huawei and its partners, a prelude to large-scale manufacturing slated for the same year.
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Oct
LINE Taiwan reveals AI agent plans for 2026
After a three-year hiatus, LINE Taiwan held LINE CONVERGE 2025 on October 22 to outline upcoming operational priorities and outlook. With all industries slowly adopting AI, AI agents are anticipated to be the next major focus following generative AI. LINE, with 22 million users in Taiwan, has the potential to leverage its ecosystem to secure a spot in the AI agent market.
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Oct
Taiwan’s secret: A century of elite talent driving chips, electronics, and healthcare
Taiwan currently shines on the global stage with three standout industries: its healthcare system, electronics manufacturing services (EMS), and semiconductors. Though each sector’s competitive edge stems from unique factors, they all share one crucial—and arguably most important—common denominator: the sustained, multi-generational commitment of the nation’s social elites. This commitment is measured not in years, but in cycles of sixty years, known as a jiazi in the traditional Chinese calendar.
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Oct
OpenAI, AMD, Broadcom unite behind Ethernet to reshape AI infrastructure
The Ethernet for Scale-Up Networking (ESUN) Alliance officially launched at the 2025 Open Compute Project (OCP) Global Summit, uniting North America’s AI heavyweights, including OpenAI, Meta, AMD, Nvidia, Microsoft, and Broadcom. Its goal is to create an open Ethernet interconnect standard to address AI chip connectivity fragmentation and redefine global AI infrastructure. The collaboration marks a rare alignment across major rivals in pursuit of interoperability.