Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged optics

Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven in the Netherlands. The new center will focus on advancing co-packaged optics (CPO) technology, aiming to accelerate innovation in photonic-electronic integration.

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China’s SiC surge leaves Wolfspeed struggling beyond bankruptcy

Wolfspeed’s recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling with weak yields in 8-inch silicon carbide (SiC) device production, while fast-growing Chinese competitors are undercutting its market share and earnings, DIGITIMES reported.

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Tech Forum 2025: Qualcomm and MediaTek take smartphone rivalry to the cloud in AI chips

With global smartphone sales leveling off, Qualcomm and MediaTek are taking their long-running rivalry into the fast-growing cloud AI ASIC market. DIGITIMES Research estimates MediaTek controlled 37% of the smartphone application processor market in 2024, ahead of Qualcomm at 27%. Together, the two suppliers accounted for more than 60% of shipments. With handset growth expected to remain stuck in the low single digits, both companies are turning to cloud computing chips as a new source of expansion.

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Research Insights: ASICs, packaging, and HBM reshape the AI chip race

The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new “decentralized” phase shaped by three forces: the expansion of custom ASICs, diversification of advanced packaging, and intensifying competition in high-bandwidth memory (HBM) pricing.

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China’s AI server market surges to US$22B, set to top US$100B by 2029

China is ramping up efforts to build an integrated nationwide computing network as the global race for artificial intelligence (AI) intensifies. The State Council’s “AI+” strategy aims for AI adoption across more than 70% of industries by 2027 and above 90% by 2030. Analysts estimate that by 2035, AI could contribute over CNY11 trillion (approx. US$1.54 trillion) to GDP, equivalent to 4-5% of the economy.

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Tech Forum 2025: 2nm race begins, advanced packaging takes the baton, Trump 2.0 reshapes chip rivalry

DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore’s Law in semiconductors. However, with short-channel effects emerging, the three leading foundries have gradually shifted from FinFET to GAAFET. Although Samsung Electronics was the first to introduce a GAAFET process in 2022, it was not until the mass production of SF3 in 2025 that it reached a true milestone.

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Infineon teams up with Nvidia on 800V data center power, eyes EUR1 billion AI business

As artificial intelligence transforms data centers worldwide, the spotlight has expanded beyond computing and networking to power semiconductors. AI chips draw enormous amounts of electricity, and each percentage point of efficiency matters. Even a 1% gain can translate into millions of dollars in savings and reduce pressure on grid infrastructure.

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