Silicon transistors are approaching their physical limits, and AI is increasing demand for higher density, performance, and energy efficiency. Advanced packaging and bonding technologies for heterogeneous integration have become crucial to the semiconductor industry. At the 27th Semiconductor Exhibition (SEDEX 2025), Samsung Semiconductor and Device Solutions (DS) Division CTO Song Jae-hyuk emphasized the growing need for cross-disciplinary collaboration.

As global demand for AI computing power skyrockets, the data center landscape is undergoing a significant transformation — shifting away from standalone server performance and toward system-level, rack-based upgrades. At the OCP Global Summit 2025, the industry spotlight moved beyond individual servers to full racks designed with 800V direct current (DC) power, liquid cooling, and high-bandwidth network integration.

Inventec, a leading Taiwanese original design manufacturer (ODM), has entered a joint venture with India’s Dixon Technologies to produce notebooks (NB), servers, desktops, and electronic components domestically. The new company, Dixon IT Devices Private Limited, will be majority-owned by Dixon (60%), with Inventec holding 40%. The jointly operated factory is scheduled for completion by the second quarter of 2026.