深纺织A辟谣以“债转股+现金注入”方式参与恒美光电重整

8月28日消息,27日在投资者关系平台上,有投资者表示,近日互联网有多则消息称:深纺织A与深圳国资联合体‌计划以“债转股+现金注入”方式参与重整,整合杉杉股份旗下恒美光电的偏光片产能,目标形成全球超50%市场份额,已获宁波地方隐性支持。这消息是不是真的呢?

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京东方上半年营收再破千亿、净利增42%,多个显示项目进程加快

2025年8月27日,京东方科技集团股份有限公司(京东方A:000725;京东方B:200725)发布2025年半年度报告,2025年上半年BOE(京东方)实现营业收入1012.78亿元,同比增长8.45%;实现归属于上市公司股东净利润32.47亿元,同比增长42.15%。在“屏之物联”发展战略的指导下,BOE(京东方)以创新驱动各项业务稳健发展,为全年整体业绩向好奠定坚实基础。

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Rebellions unveils chiplet AI accelerator to challenge Nvidia in hyperscale market

Korea-based Rebellions unveiled its next-generation AI accelerator, REBEL-Quad, at the Hot Chips 2025 symposium in California, positioning itself as a direct rival to Nvidia’s Blackwell processors. The chip is the world’s first neural processing unit (NPU) to adopt the UCIe-Advanced standard for chiplet interconnect, a design that enables faster and more power-efficient data transfer.

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Quanta’s Techman Robot prepares for IPO with backing from chairman Barry Lam

At a pre-IPO briefing held on Monday, Techman Robot, a leading Taiwanese collaborative robot (cobot) manufacturer, laid out its vision for the future as it prepares to debut on the capital markets. The event was marked by a personal appearance from Barry Lam, chairman of Quanta Computer, Techman’s parent company, who praised the company’s achievements and symbolic significance.

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The 7-year car loan becomes new standard in America

The traditional five-year auto loan is no longer the norm in the US. Driven by rising vehicle prices—fueled in part by tariffs on cars and auto parts—limited vehicle availability, and inflation reshaping consumer behavior, longer-term financing has become increasingly common. Six-year loans now dominate the market, while the share of seven-year loans is climbing at a record pace.

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Nvidia’s CoWoP PCB architecture targets ABF substrates but faces warpage risk

Nvidia’s new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key suppliers involved in early development include Taiwan’s Zhen Ding Technology Holding, Unimicron Technology Corp., and Compeq Manufacturing Co., along with China’s WUS Printed Circuit (Kunshan) Co. and Victory Giant Technology (HuiZhou) Co.

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