Samsung Electronics and SK Hynix are each reviewing locations in South Korea’s Honam region for new semiconductor packaging plants, according to The Elec and Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the automation equipment maker moves to strengthen long-term development and leadership succession. Sun will remain on the board and has also been named honorary chairman.
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea’s ETNews, which cited industry sources.
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