Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer validation, South Korean media reported. The announcement would end Samsung’s earlier silence and signal to the market that its technology is keeping pace with competitors.

At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950’s new “P/D separation” design. The architecture splits large language model (LLM) inference into distinct tasks, making it the standout highlight of the launch.

Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate on packages for silicon carbide (SiC) power semiconductors.

South Korea’s largest automotive parts manufacturer Hyundai Mobis is grappling with consecutive strikes at its production subsidiaries, forcing partial shutdowns at Hyundai Motor and Kia factories that rely on these components. After being hit by tariffs and the detention of Korean workers in the US, the automotive component industry now faces strikes that are using production lines as bargaining chips, plunging the automotive industry into a threefold crisis.