Huawei declares supernode era to eclipse Nvidia within 2 years

At Huawei Connect 2025, the company rolled out a three-year roadmap for its Ascend chips alongside the debut of its Atlas 950 supernode. Rotating chairman Eric Xu warned that China’s AI future can no longer hinge on single-chip performance, constrained as it is by advanced process limits. The way forward, he argued, is a “supernode + cluster” architecture — Huawei’s bet on system-level design to secure scalable and sustainable compute.

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Tesla reportedly recruiting semiconductor talent to boost AI6 chip and 2nm Samsung collaboration

Tesla is actively recruiting semiconductor experts to enhance its next-generation chip development and mass production capabilities. Recent reports indicate that Samsung Electronics’ foundry division secured the wafer fabrication order for Tesla’s “AI6” chip. Consequently, this recruitment drive likely aims to improve AI6 yield rates and strengthen cooperation with Samsung.

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Nvidia-Intel alliance to boost long-term demand for ABF substrates

Nvidia and Intel have announced a rare partnership to jointly develop next-generation AI data center and PC platform chips. Despite predominantly negative market interpretations, the industry remains optimistic that this “powerful collaboration” will promote closer integration of GPU and CPU designs, thereby driving increased demand for high-end ABF substrates. Leading suppliers closely working with both companies are expected to be the biggest beneficiaries.

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