The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung Electronics and TSMC, which are set to clash over next-generation 2nm process technologies. Equally critical is the unfolding battle over sixth-generation high bandwidth memory (HBM4), a segment poised to redefine performance benchmarks in AI computing.
As the smartphone industry enters the second half of 2025, attention is turning toward the final chapter of 3nm system-on-chip (SoC) flagships. Apple, MediaTek, and Qualcomm are all expected to transition to the 2nm process node by 2026, making this year’s releases the swan song for 3nm chips.
Samsung Electronics executives met with BOE Technology leaders in July 2025 to discuss LCD panel procurement, even as the company remains locked in a legal dispute with Samsung Display. After filing a patent infringement suit in Texas in late May 2025, BOE followed up with a second claim against Samsung Display in the same court less than two months later.
Since its release, F1 has burned rubber at the box office, not only becoming a major success for Apple but also accelerating as an important and exciting reference in the history of automotive technology development.
Production of Apple’s AirPods at Foxconn’s Telangana factory has encountered supply disruptions due to China’s tightening grip on rare earth element exports, particularly dysprosium—an essential component used in high-performance magnets inside AirPods. The shortage reflects the growing impact of geopolitical tensions on global tech supply chains.
Taiwanese Vice President Bi-khim Hsiao has expressed her stance on the US imposition of Section 232 tariffs for the first time, pointing out that the US and Taiwan ultimately have the same goal.
As the US prepares to impose steep tariffs on imported copper, global copper prices have rebounded, raising concerns about rising costs across copper-intensive industries. Among the most vulnerable is the copper-clad laminate (CCL) industry, a foundational pillar of printed circuit board (PCB) manufacturing, where higher raw material prices could compress margins and trigger price hikes downstream.