映日科技启动北交所IPO辅导
9月4日，证监会网站显示，芜湖映日科技股份有限公司(以下简称“映日科技”)在安徽证监局办理辅导备案登记，拟向不特定合格投资者公开发行股票并在北交所上市，辅导机构为中信建投证券。
04
Sep
04
Sep
AR眼镜企业Rokid签约落户珠海
近日，国内AR眼镜领域头部企业——杭州灵伴科技有限公司（“Rokid”）正式签约落户珠海高新区。Rokid由珠海科技集团投资引进，计划入驻该集团旗下智谷圆芯产业园。
04
Sep
富士康衡阳工厂宣布关停！
9月4日消息，鸿富锦精密工业（衡阳）有限公司于2025年8月28日发布通知，宣布因“市场环境影响，主要客户经营策略调整”，公司未来已无足够订单支撑运营，决定于2025年9月30日正式停止运营。
04
Sep
Baidu, Huawei push supernode clusters to sidestep chip limits in China’s AI race
The generative AI surge is accelerating at record pace, with computing power emerging as the decisive asset. As advanced AI chips grow scarce under tightening export controls, China is pursuing workarounds — from cloud platforms to supernode clusters and leasing models — to secure a self-sufficient computing ecosystem.
04
Sep
Unlikely alliance launches US$24M push into Taiwan’s robotics market
A surprising new alliance is disrupting Taiwan’s robotics and unmanned vehicle industry. A veteran food manufacturer, a key supplier to TSMC, and a leading machinery firm have joined forces in a partnership that is drawing widespread attention across the sector.
04
Sep
China’s new electric bike standard takes effect, driving trade-in boom
The electric bike market in China has entered a new phase. Starting September 1, the mandatory national standard “Safety Technical Specification for Electric Bicycle” has been implemented at the production level. Electric bike manufacturers are now required to transition all products to meet the new standard, while models that meet the old standards will gradually be phased out.
04
Sep
Research Insights: TSMC faces the next decade of chip war from Arizona to Beijing
Taiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global expansion but also a reversal of long-standing skepticism about America’s ability to sustain advanced chip manufacturing.
04
Sep
AMD, Anritsu partner to standardize high-speed testing for AI data centers
Japan’s Anritsu has teamed up with US chipmaker AMD to launch an automated testing platform for next-generation high-speed transmission, targeting the surging demand from AI data centers. The solution, called System Board Passive Channel (SBPC) Analysis Master, enables consistent validation across diverse devices and environments.
04
Sep
Nextlink buys Renova Cloud to enter Vietnam’s cloud market
Taiwan-based Far EasTone Telecommunications (FET) is strengthening its international and cloud strategy through its cloud business, Nextlink. FET has announced it has signed a 100% share acquisition agreement with Hong Kong-based cloud service technology firm Renova Cloud, through which FET will gain control of Renova Cloud’s subsidiary in Vietnam.
04
Sep
Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged optics
Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven in the Netherlands. The new center will focus on advancing co-packaged optics (CPO) technology, aiming to accelerate innovation in photonic-electronic integration.