Pixio推出初音未来联名27英寸显示器
9月2日消息，日本显示器厂商Pixio昨日宣布推出初音未来联名款显示器PX278 Wave/HATSUNEMIKU。该显示器预计将于今年末~ 明年初的冬季发售。
02
Sep
02
Sep
新研究将OLED与全息超表面首次结合，解决全息技术大规模普及难题
9月2日消息，圣安德鲁斯大学一项新研究为全息技术发展奠定基础，该技术未来或可改变智能设备、通信、游戏及娱乐行业的现有形态。
02
Sep
清溢光电：职工代表监事陈海英辞职
清溢光电（SH 688138）9月1日晚间发布公告称，因个人原因，陈海英女士申请辞去公司第十届监事会职工代表监事职务，陈海英女士辞任职工代表监事后，不在公司担任任何职务。
02
Sep
郑州富士康加班生产iPhone17
9月1日消息，苹果公司将于北京时间9月10日凌晨1点举行iPhone17系列发布会，随着新品发布时间临近，苹果供应链富士康、蓝思科技等正在加紧生产制造iPhone17系列。
02
Sep
60亿元，恒美光电收购三星SDI偏光片完成交割
9月2日消息，据“诺延资本”1日，在诺延资本主导下，恒美光电通过子公司恒新光电与三星SDI（SAMSUNG SDI CO., LTD.）签署交割文件，正式完成对三星SDI偏光片业务的并购交割，交割范围包括三星SDI的偏光片相关全部资产。这是恒美光电全球化布局的重要一步，同时再次推动产业迈向高质量发展的新阶段。
02
Sep
不超5.1亿元，苏大维格拟收购常州维普不超51%股权
9月1日晚间，苏大维格（300331）披露公告，公司拟筹划以现金方式收购常州维普半导体设备有限公司（以下简称“常州维普”）不超过51%的股权，收购完成后，预计实现对标的公司的控股。
02
Sep
China’s AI chip hopefuls step into Nvidia’s void
The global AI surge has turned computing power into a core strategic resource. With Washington tightening curbs on advanced GPU exports, Nvidia’s revenue in China has collapsed, opening a rare market window for domestic AI chipmakers.
02
Sep
BYD’s quarterly revenue drops 30%, highlighting the growing importance of overseas markets
BYD’s financial report reveals a 30% year-over-year decline in profit for the second quarter of 2025. This drop not only fell short of market expectations but also marked the first decline since 2021, underscoring how intense price competition in China’s automotive market is affecting even industry leaders.
02
Sep
Korean media highlight Taiwan’s hard line in TSMC leak
Taiwan’s prosecutors are pursuing a 14-year prison term in a high-profile TSMC trade secrets case, underscoring how Taipei views semiconductor technology leaks as threats to national security. The indictment, handed down on August 27, 2024, charged three suspects with violating the National Security Act and misusing core technology abroad. The defendants face potential sentences of 14, nine, and seven years, according to the Intellectual Property Branch of the Taiwan High Prosecutors’ Office.
02
Sep
Hanwha Semitech advances fluxless bonding to address HBM packaging strains
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to address the challenge with advanced fluxless bonding tools, targeting the market for HBM4 and beyond.