SoftBank to launch high-altitude 5G network using solar planes and airships by 2026
Taiwan eyes Starlink partnership in bid to bolster LEO infrastructure
Foxconn affiliate bets on robotics, eyes axial motor breakthrough by year-end
Intel cuts jobs at Israel’s Fab 28 as new CEO rethinks global footprint
Tariffs impact economy, but AI servers remain an exception, says Wistron
Exclusive: US drone makers Skydio, Anduril turn to Taiwan for key supply chain support
Tariffs bite: China–US trade drops 9% in 1H as chip imports, rare earth exports climb
China–US trade fell 9.3% year-over-year in the first half of 2025, totaling CNY2.08 trillion (approx. US$290 billion), according to data released by the General Administration of Customs on July 14. Chinese exports to the US dropped 9.9% to CNY1.55 trillion, while imports from the US fell 7.7% to CNY530.35 billion during the same period.
BOE pivots beyond displays to glass substrate packaging, perovskite solar
Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers
As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.