SoftBank to launch high-altitude 5G network using solar planes and airships by 2026

SoftBank is preparing to commercialize its next-generation telecommunications infrastructure using high-altitude platforms by 2026, marking a pivotal milestone in its UTX (Ubiquitous Transformation) initiative. The company announced that it will deploy a hybrid fleet of solar-powered aircraft and unmanned airships to operate base stations in the stratosphere, approximately 20 kilometers above the Earth’s surface. This dual-platform system is expected to support emergency communications first, with plans to expand into broader commercial services by 2027.

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Intel cuts jobs at Israel’s Fab 28 as new CEO rethinks global footprint

Intel has initiated job cuts at its Fab 28 wafer fabrication plant in Kiryat Gat, Israel, marking the first time the facility—one of the chipmaker’s three largest global manufacturing hubs—has been affected by broader company-wide downsizing. The move comes as new CEO Lip-Bu Tan accelerates efforts to streamline Intel’s sprawling global operations and eliminate organizational inefficiencies.

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Tariffs impact economy, but AI servers remain an exception, says Wistron

Wistron president and CEO Jeff Lin stated that AI servers represent a rigid demand and are not affected by reciprocal tariffs. However, mature consumer products such as notebooks and smartphones are likely to face challenges due to tariff impacts. Lin also revealed that in response to the US reciprocal tariffs, Wistron has prepared multiple contingency plans labeled Plan A, B, C, D, and E, although details of the tariffs remain unclear and customers have yet to provide definitive instructions.

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Exclusive: US drone makers Skydio, Anduril turn to Taiwan for key supply chain support

A wave of next-generation defense contracts from the US Department of Defense is poised to transform the global unmanned systems industry in 2025, and Taiwan may play a pivotal role. With the Pentagon expected to release a large volume of unmanned vehicle orders next year, US defense tech startups are racing to secure production capacity. Many of these firms, while brimming with innovation, face significant constraints in manufacturing scale, opening the door for Taiwan’s precision-driven, China-free supply chain.

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BOE pivots beyond displays to glass substrate packaging, perovskite solar

BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology as strategic growth drivers. The initiative targets high-value semiconductor backend processes and automotive electronics, aiming to diversify beyond BOE’s maturing display business.

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Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.

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