Huawei’s HiSilicon debuts low-power Cat.1 chip to boost IoT reach

On July 10, 2024, Huawei’s chip subsidiary HiSilicon launched its first Cat.1 IoT communication chip — the Hi2131 — officially entering the fast-growing cellular IoT market, which sees annual shipments exceeding 200 million units. Based on 4G LTE, Cat.1 offers a cost-effective, power-efficient, and widely deployable solution for mid-to-low-speed data scenarios, including shared mobility, smart security, wearables, and mobile payment devices.

Continue reading

Taiwan launches smart robotics talent program to compete with semiconductor sector

Taiwan is positioning robotics as a national growth engine, with Premier Cho Jung-tai naming it a top strategic priority alongside semiconductors and drones. To accelerate progress from hardware dominance to software-driven applications, the National Science and Technology Council (NSTC) will roll out a high-level smart robotics talent development program starting in 2026.

Continue reading