03
Mar
Rapidus will co-develop 2nm image-processing semiconductors with Canon for cameras and surveillance devices, Nikkei reported, and will trial-produce chips at Rapidus’s Chitose, Hokkaido, facility with Synopsys also participating.
03
Mar
Samsung, SK Hynix expand hiring as HBM, DRAM demand enters supercycle
With the semiconductor industry entering a supercycle and reporting record earnings, Samsung Electronics and SK Hynix are preparing to launch large-scale semiconductor hiring.
03
Mar
Getac eyes defense digitalization amid Middle East conflict escalation
The intensifying conflicts in the Middle East are fueling demand for defense digitalization. Getac Holdings chairman James Hwang noted that as countries worldwide increase their defense budgets and adopt new warfare technologies like drones and AI digitalization, Getac’s defense-related revenue, which accounted for about 20% in 2025, is expected to grow further in 2026.
03
Mar
The KTC M27T6S is now available overseas, sports a 27″ QHD QD-Mini LED display
03
Mar
AI server boom strains tantalum capacitors; MLCC substitution falls short
The global expansion of AI computing infrastructure is accelerating, but supply shortages across the component supply chain continue to widen. Alongside constrained supply of memory and T-glass fiberglass cloth, tantalum capacitors, valued for high capacitance and compact size, have emerged as the latest passive component facing shortages, adding uncertainty to AI server shipments.
03
Mar
China hits 140 humanoid robot OEMs, 330 models; supply chain ramps
By 2025, China had more than 140 humanoid robot OEMs, with over 330 products launched in a single year. The rapid increase in vendors and models is prompting synchronized expansion across the upstream, midstream and downstream supply chain.
03
Mar
FIT unveils 102.4T CPO external laser solution for AI data centers at OFC 2026
As AI model training scales up and cloud service providers (CSPs) accelerate the buildout of high-performance data centers, switch bandwidth is moving from 51.2Tbps to the 102.4Tbps generation, raising stricter requirements for power consumption, thermal management and serviceability in high-speed optical interconnects. Co-packaged optics (CPO) is regarded as a key architecture to overcome the power limitations of traditional pluggable optical modules, driving laser modules, packaging integration and high-speed interconnect technologies to the forefront of supply chain deployment.
03
Mar
Holtek and Generalplus expand edge AI to smart appliances and glasses
The surge of artificial intelligence (AI) technology is driving its widespread growth across applications, with edge computing emerging as a core strategy for microcontroller (MCU) makers. Holtek and Generalplus Technology have both developed edge AI technologies to capture opportunities in smart home appliances, voice-interactive toys, and smart glasses.
03
Mar
South Korea, Singapore launch FTA upgrade focused on AI, SMR nuclear, space, and quantum
South Korean President Lee Jae Myung met Singapore Prime Minister Lawrence Wong on March 2 and agreed to launch negotiations to upgrade the bilateral free trade agreement (FTA). The upgrade expands cooperation beyond traditional trade into artificial intelligence (AI), small modular reactors (SMR), space and satellite technology, and quantum science, reflecting a shift toward structured technology and energy collaboration.
03
Mar
UK space leaders join global industry figures at Space-Comm Expo
The organizers of Space-Comm Expo Europe have confirmed the final lineup of speakers for what is set to be Europe’s largest commercial space gathering, taking place March 4-5 at ExCeL London.