26 May
Latest News and Trends

LED maker Ennostar pivots to optical interconnects after high-value shift agin traction

Ennostar Holdings’ transformation has begun to show clear results, with chairman Paul Peng saying the company’s “3+1” strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performance.

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26 May
Latest News and Trends

Chiplet boom puts Taiwan’s InPsytech and its AI connectivity IPs in the spotlight

As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly that.

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26 May
Latest News and Trends

Samsung’s reported 900-layer V-NAND prototype puts NAND race with YMTC in focus

The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutting power consumption.

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