Research Insight: strong momentum expected for data center AI chip packaging in 2025-2030

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips (such as Google’s TPUs), AI server CPUs, and networking/interconnect-related chips (e.g., Switch ASICs/rack-scale-up Interconnect Chips/DPUs & NICs).

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Cable makers see short-term gains from rising copper prices

Amid the recent surge in copper prices, cable maker Taya points to potential short-term benefits from inventory appreciation, but long-term profits will still depend on inventory management and adaptability. Meanwhile, competing cable firm Walsin Lihwa notes that the company’s comprehensive hedging mechanisms will help maintain stable gross margins, and the impact has been limited due to the long-term nature of most cable contracts.

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SK Hynix restructures global operations amid reported HBM4 production delay

SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic shift comes as a ZDNet Korea report indicates the South Korean chipmaker may postpone mass production of its next-generation HBM4 chips due to timeline changes for Nvidia’s Rubin AI accelerators.

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