Commentary: From Biden’s spending spree to Trump’s Intel stake, US industrial policy is infused with personal will

As the US government seriously considers taking a stake in Intel, the company faces more than just a simple transaction; it has become a strategic industry bet. Once the semiconductor leader, Intel’s lagging advanced process technology has gradually eroded its ability to compete with TSMC and Samsung Electronics at the 7nm, 5nm, and even upcoming 2nm nodes. Meanwhile, construction delays at the Ohio wafer fab have hindered the US government’s carefully crafted blueprint for domestic advanced manufacturing from materializing.

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Commentary: Who will lead GaN market after TSMC’s 2027 exit?

Gallium nitride (GaN) semiconductors are on the brink of a major transformation. Once hailed as the rising star among third-generation semiconductors, this technology has fallen from grace due to intense price competition in the Chinese market. Now, with global GaN foundry leader TSMC announcing its withdrawal by mid-2027, the entire industry is entering an early era of fragmentation reminiscent of the Warring States period.

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Jung-hua Chang appointed Tatung chairman; Wkang-hsiang Wang transitions to president

Taiwan-based Tatung has appointed Jung-hua Chang as its new chairman; Chang is also the chairman of Sanlih Entertainment Television (SET). The announcement was made during an extraordinary board meeting on August 19. The personnel change will take effect on August 20. Current Tatung chairman Wkang-hsiang Wang will transition into the role of company president.

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Giga Solar’s subsidiary breaks ground on 60MW solar plant in the Philippines

Giga Solar Materials, a leading solar conductive paste manufacturer in Taiwan, announced on August 19 that its renewable energy arm, Whole Sun Green Power, has begun construction of the 60-megawatt (MW) Taysan solar power plant in Batangas Province, Philippines. The project is being developed in partnership with Wyn Power Corporation and Edward Marcs Philippines Inc.

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Commentary: CXMT targets HBM3 by 2026 as Trump redefines chip trade calculus

Like advanced AI processors, high-bandwidth memory (HBM) has been a target of US export curbs under former President Joe Biden. HBM capacity and bandwidth shape the speed and efficiency of AI training and inference. From Nvidia’s H100 to the GB200, HBM capacity has grown 2.4 times and bandwidth 2.6 times. Despite that, China still lacks self-developed HBM and cutting-edge AI chips, which have been left exposed to Washington’s pressure points.

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