Efun targets semiconductor packaging and OLED displays with water and gas barrier films

Optical film manufacturer Efun held its shareholders’ meeting, successfully passing all proposals. Efun highlighted that with technological advancements, the demand for next-generation smartphones and AI products is becoming increasingly widespread. The key components of these products—semiconductor chips and OLED displays—require large quantities of water and gas barrier films used in packaging to ensure component longevity.

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TSMC takes all: Google follows major smartphone chipmakers in embracing 2nm

Recent market reports indicate that leading companies such as Apple, Qualcomm, and MediaTek are highly likely to fully adopt 2nm chips by 2026. Google, having recently shifted its chip production from Samsung Electronics to TSMC, may also join this trend to ensure its hardware manufacturing processes keep pace with other industry leaders and maintain competitive strength.

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全球首台!合肥欣奕华中大尺寸卷对卷钙钛矿蒸镀设备出货

6月27日消息,据“合肥欣奕华”,近日,合肥欣奕华智能机器股份有限公司(简称“欣奕华智”)成功出货全球首台中大尺寸卷对卷(Roll-to-Roll)钙钛矿蒸镀设备,标志着我国在柔性钙钛矿太阳能电池大规模制备领域实现关键性技术突破,向实现自主可控和全球引领再进一步。

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