Nvidia’s 800V push powers GaN boom; Micro Silicon leads in testing

Following Nvidia’s announcement to initiate a revolution in AI server power technology, with plans to fully implement 800V high-voltage direct current (HVDC) power architecture designs by 2027, semiconductor testing, packaging, and wafer thinning company Micro Silicon Electronics highlighted that this trend will become a new highlight for gallium nitride (GaN) end applications. Once mass production officially ramps up, the third category semiconductor testing business is expected to experience robust growth.

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Tariff fears ease for Taiwan’s ICT leaders, but legacy industries risk harder hit

Rock Hsu, President of Kinpo Group and recipient of the Venture Capital Lifetime Achievement award, made a rare joint appearance on August 12 at Taiwan’s annual Venture Capital Association meeting, alongside Ray Chen, Chairman of the Board of Compal Electronics, and Chieh-Li Hsu, General Manager of AcBel Polytech. The gathering became a platform for candid commentary on the economic ripple effects of evolving global trade tensions.

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CAMM poised to replace SO-DIMM in high-end notebooks by 2026

Despite the impact of New Taiwan dollar appreciation, connector manufacturer Argosy announced at its earnings call on August 11, 2025, that due to the continued market penetration of DDR5 and ongoing optimization of product shipment mix, revenue for the second quarter of 2025 is expected to grow 33% year-over-year, falling within the previously forecasted range of 30-40%.

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Samsung wins Apple iPhone image sensor deal in Texas, eyes Qualcomm next

Samsung Electronics plans to begin producing its in-house–designed high-performance CMOS image sensors (CIS) at its Austin, Texas, wafer fab in 2027 for Apple’s iPhones. Industry analysts in South Korea say the tech giant’s one-stop strategy, which covers both design and manufacturing, proved decisive in securing the deal as Apple seeks to expand US-based production.

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