New front opens in CPO, SiPh race: TSMC and Taiwanese supply chain in the lead

Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting high-bandwidth, low-latency data exchange needs, silicon photonics (SiPh) and co-packaged optics (CPO) are emerging as foundational technologies for next-generation AI system performance.

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Urgent orders boost memory packaging and testing in 2Q25; AI stabilizes variables for 2H25

Benefiting from a rapid recovery in memory market demand during the first half of 2025, memory packaging and testing companies are sharing in the gains. Although the US 90-day tariff exemption period is about to expire, increasing uncertainties around order visibility starting from the third quarter are expected to make customers adopt more conservative stocking strategies.

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Exclusive: Understanding Taiwan is key to understanding the world, says MWC CEO

The 2025 Mobile World Congress in Shanghai (MWC Shanghai) officially opened on June 18, 2025. Just before the event, Francesc Fajula, CEO of Mobile World Capital Barcelona, made his first visit to Taiwan and granted an exclusive interview to DIGITIMES. He shared his views on the Shanghai exhibition and emphasized Taiwan’s critical role in the global technology ecosystem.

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