LPKF reportedly enforces glass substrate patents amid intensifying industry competition

German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture as competition in the emerging field intensifies. Industry observers see this move as a strategic effort to raise barriers to entry as global interest in glass-based substrates grows.

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SpaceX eyes FOPLP as Washington pushes chip packaging reshoring

Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The company aims to establish a new advanced packaging factory “built in Texas.” Before the Texas facility becomes operational, orders are currently being handled by STMicroelectronics. Due to strong demand, overflow orders have reportedly been subcontracted to Taiwan’s major panel manufacturer Innolux.

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