Commentary: YMTC’s 3D DRAM push challenges CXMT and global memory leaders

China’s push to localize its memory supply chain is gathering momentum. YMTC has begun trial production at its first fully localized NAND flash fab, while market chatter indicates the company is now quietly investing in DRAM. The move underscores YMTC’s ambition to extend beyond NAND dominance, using its patented Xtacking technology to break into DRAM and challenge the world’s top three players.

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Semicon India 2025: Kaynes Semicon forges key partnerships to strengthen local chip ecosystem

Kaynes Semicon, a subsidiary of Kaynes Technology and India’s first advanced OSAT and module manufacturer, has announced a series of strategic partnerships during Semicon India 2025, held from September 2-4, 2025. The collaborations underscore India’s push to expand its semiconductor manufacturing and testing capabilities, while positioning Kaynes as a key industry player, according to multiple reports, including The Economic Times, Electronics Media, DQ India, and Devdiscourse.

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China’s SiCarrier returns to equipment expo with bold claims, but industry has doubts

At the 13th China Semiconductor Equipment, Core Components and Materials Expo (CSEAC 2025) in Wuxi, Chinese equipment maker SiCarrier returned with another high-profile showcase. The firm exhibited images and scale models of semiconductor process tools, continuing the publicity blitz it began at SEMICON China earlier this year. But industry skepticism persists over whether its touted technological advances are genuine.

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Resonac launches JOINT3 alliance to develop next-gen semiconductor tech

Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related firms. The alliance aims to expedite the development and commercialization of advanced semiconductor technologies within five years through a collaborative investment of JPY26 billion (US$175.22 million), representing Resonac’s largest semiconductor technology partnership to date.

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Intel’s Dalian plant officially renamed SK Hynix amid US export controls tightening

The US Department of Commerce announced on August 29, 2025, that it will revoke the “Validated End-User” (VEU) status previously granted to Samsung Electronics and SK Hynix for their semiconductor factories in China. Starting January 2026, South Korean companies will need to apply for case-by-case approval to introduce American equipment into their Chinese production lines.

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Kinpo expects balanced revenue growth in 2025 amid tariff-driven market shifts

Kinpo Group president Andrew Chen announced on September 3 that the company expects a more balanced revenue split in 2025, departing from their usual stronger second half caused by earlier stockpiling due to US tariffs. Chen also noted a 27% year-over-year revenue rise in the first quarter of 2025, followed by a decline in the second quarter amid market caution linked to tariff policies.

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