29
May
NVIDIA today announced robust financial results for the first quarter of fiscal year 2026, reporting significant year-over-year and sequential growth, driven primarily by its Data Center segment.
29
May
Catcher targets four sectors, leaves behind auto
Catcher chairman Shui-Shu Hung announced that the company is focusing on developing three new sectors: medical, semiconductor, and aerospace, alongside its established information technology industry operations. Excluding the information technology sector, which faces significant uncertainties in the second half of 2025 due to international circumstances, the growth potential in the other new fields is “limitless.” He also stated that Catcher has already exited the automotive market, which it had actively pursued previously, saying “goodbye” to automotive.
29
May
Currency crunch stalls Nanya PCB, yet cloud and edge AI bets are just getting started
Nan Ya Printed Circuit Board Corporation (Nanya PCB), a top Taiwanese IC substrate maker, cautioned that second-quarter earnings may miss forecasts, citing the sharp rise of the New Taiwan dollar and policy uncertainty surrounding President Trump’s proposed reciprocal tariffs. At the May 27 shareholders meeting, Chairman Chia-chau Wu noted that AI-related substrate demand has kept Taiwan’s capacity running at high levels, outperforming China, but rising currency pressures and trade tensions are now dragging on export sales.
29
May
Japan plans major US chip purchases as leverage in tariff talks
In ongoing tariff negotiations between Japan and the US, the Japanese government has proposed purchasing semiconductor products from American manufacturers worth several billion US dollars. This move aims to serve as a bargaining chip for reducing the US trade deficit with Japan.
29
May
Hygon–Sugon merger retools China’s AI backbone with full-stack compute integration
Hygon Information Technology and Dawning Information Industry Co. (Sugon) announced a strategic merger on May 25, 2025, a move widely seen as aligning with Beijing’s agenda to consolidate its computing infrastructure and fast-track technological self-reliance. Hygon, valued at roughly CNY316 billion (US$43.95 billion), focuses on domestic CPUs and data processing units (DCUs), with five chip generations in use across finance, telecom, artificial intelligence, and enterprise data centers.
29
May
Acer Cyber Security leverages system integration to target double-digit growth in 2025
Acer Cyber Security Inc. (ACSI), the cybersecurity arm of Acer Group, expects stronger momentum in the second half of 2025 and is targeting double-digit revenue growth for the full year, according to President Rex Wu. Speaking at the company’s May 27 shareholders meeting, Wu cited sustained demand for cybersecurity solutions and the firm’s expanding system integration business as key growth drivers.
29
May
Taiwan drone alliance lands more allies at Xponential 2025 Expo
The Taiwan Excellence Drone International Business Opportunities Alliance (TEDIBOA) led a number of Taiwanese drone companies to participate in the Xponential 2025 exhibition in Houston, Texas, with the hope of further expanding drone cooperation opportunities between Taiwan and the US.
28
May
Gtoc bets on Vietnam and ultra-thin glass in push for display dominance
As global display technologies pivot toward thinner, lighter, and more flexible form factors — especially for automotive and smart device applications — Taiwanese glass processor Gtoc Optoelectronics is making a bold move into next-generation materials. The company announced a strategic expansion into the ultra-thin rollable glass cover market, positioning itself as a key supplier for high-end automotive displays and precision glass applications.
28
May
Notebook shipment update, April 2025
Under the dual impact of reciprocal tariffs and seasonal downturn, combined notebook shipments of the top five brands dropped by 26% month-over-month in April 2025.
28
May
Nvidia partners with top chipmakers to develop 800V HVDC power systems for AI data centers
Nvidia has unveiled a bold move to revolutionize data center infrastructure with the introduction of an 800-volt high-voltage direct current (HVDC) power distribution system, designed for next-generation AI workloads. Announced recently, the initiative involves strategic partnerships with three major power semiconductor suppliers — Infineon Technologies, Texas Instruments (TI), and Navitas Semiconductor — to co-develop this advanced power solution.