Memory chipmaker MXIC reported a net loss of NT$862 million (US$28.1 million) in the third quarter of 2025, marking its ninth consecutive quarterly deficit. Chairman Miin Wu candidly expressed disappointment over the results and apologized to investors, announcing he will return to frontline management starting November 2025 to lead R&D and align products with market demand, aiming for a turnaround within a year.

Nvidia CEO Jensen Huang has dismissed AI bubble concerns at GTC DC, claiming that market demand is real and tangible. He stated that customers are willing to pay for powerful AI models and that the market remains healthy.

US President Donald Trump has approved South Korea’s construction of a nuclear-powered submarine at the Philadelphia Naval Shipyard in an effort to strengthen their alliance. South Korea will pay US$350 billion in exchange for a reduction in tariffs and will make large-scale purchases of US oil and natural gas. Its total investment in the US is expected to exceed US$600 billion.

Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company’s advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging as one of the fastest-growing areas in the semiconductor industry.