Global Electronics Association joins AMD and ASE to encourage advanced packaging standardization at IMPACT 2025

The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting a special forum, “Component to System-Level Integration.” The session brought together leading companies, including AMD, ASE Group, Kinsus, and Wistron, to discuss the development and standardization needs of advanced packaging technologies in the AI era.

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Taiwan’s drone industry value doubles in two years

Chinese drone maker DJI had once dominated over 70% of the global consumer drone market and as much as 90% in the US. However, Taiwan’s domestic drone makers in recent years have begun to shine in the dual-use (civilian and military) market. The industry’s production value surpassed NT$5 billion (approx. US$163 million) in 2024 and is expected to exceed NT$10 billion in 2025.

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Samsung’s HBM4 logic die yield reportedly surpasses 90% ahead of Nvidia final tests

Samsung Electronics is preparing to enter the final quality testing phase for Nvidia’s sixth-generation high-bandwidth memory (HBM4), as its foundry division ramps up wafer production of the logic dies. Industry sources cited by media outlets including Chosunbiz and G-enews report that Samsung Foundry’s 4nm process logic die yield has exceeded 90%, signaling readiness for mass production.

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South Korea’s APEC CEO Summit to spotlight AI

The Asia-Pacific Economic Cooperation (APEC) CEO Summit will take place from October 28-31, 2025, in Gyeongju, South Korea, gathering about 1,700 global business and economic leaders including Nvidia CEO Jensen Huang and AWS CEO Matt Garman. The event is expected to highlight both the geopolitical tensions between China and the US as well as place a strong focus on technology innovation, particularly artificial intelligence (AI).

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The quiet duopoly powering AI server substrates: Taiwan and Japan’s next supply edge

Eclat Forever Machinery (EFM), a Taiwan-based maker of advanced IC substrate equipment, told investors it expects stronger performance in 2026 than in 2025. Chairman Chou Cheng-chun said demand from major AI server chipmakers remains strong, driving Taiwan’s IC substrate leaders to commit billions of New Taiwan dollars to capacity expansion. Combined with EFM’s push to diversify its product portfolio, the company expects steady growth momentum ahead.

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Pegatron’s ASRock Rack nears IPO with surging AI server sales as Chairman T.H. Tung signals more spin-offs

Pegatron Group’s server subsidiary ASRock Rack is preparing to go public, marking a key milestone in the group’s broader transformation. Pegatron Chairman T.H. Tung personally attended ASRock Rack’s pre-IPO investor meeting on October 20 to show his support, joking that he came to embrace his “golden grandson.” Tung also revealed that more subsidiaries are preparing for spin-offs following ASRock Rack’s listing, signaling an active restructuring drive within the group.

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