Ardentec partners with Delta Energy for small hydropower collab to diversify green energy procurement

Semiconductor professional testing company Ardentec announced on July 1 that it has partnered with Delta Energy to launch an eight-year small hydropower green energy trading cooperation. The project is expected to generate up to 8 million kWh of green electricity, strengthening the company’s resilience in stable power supply management of renewable energy and enhancing its ability to respond to energy risks.

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WiseChip subsidiary UHydrogen enters green energy sector with AEM technology transfer from NCU

National Central University (NCU) and UHydrogen, a subsidiary of PMOLED display manufacturer WiseChip Semiconductor, have completed a technology transfer agreement involving key green hydrogen production technology. NCU has officially authorized UHydrogen to use its latest-generation Anion Exchange Membrane Water Electrolysis (AEM-WE) technology for hydrogen production.

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Samsung completes development of 1c DRAM, paving way for HBM4 rollout

Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product has received internal Production Readiness Approval (PRA), signaling it has met key quality and performance benchmarks and is now in the final phase before mass production. The milestone brings Samsung one step closer to its goal of mass-producing HBM4, or fourth-generation high-bandwidth memory, in the second half of 2025.

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Details of the US-China trade agreement remain unclear, with no consensus on rare earths and chip controls

On June 26, 2025, US President Donald Trump announced that the US had signed a trade agreement with China on June 25, which was also confirmed by China’s Ministry of Commerce. From the talks in Geneva on May 11 to negotiations in London on June 10, followed by Trump’s recent announcement, what exactly have the two countries agreed upon?

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Intel plans to abandon in-house glass substrate development, shift to external procurement

According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing ready-made solutions from specialized suppliers. This move is expected to help Intel accelerate the launch of viable products while diversifying risks and maintaining flexibility to switch suppliers.

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