As weaker players increasingly bow out of China’s new energy vehicle (NEV) market, newcomers are now shifting their emphasis to smart platforms, the integration of battery, motor, and vehicle control systems, and supply chain resilience. In line with this trend, Xpeng, one of the three leading NEV startups in China alongside NIO and Li Auto, has recently launched its latest SEPA 3.0 platform and introduced a hybrid silicon carbide (SiC) module designed to balance efficiency and cost.

Zhao Weiguo, the former chairman of China’s Tsinghua Unigroup and once a high-profile figure in China’s semiconductor ambitions, was sentenced on May 14, 2025, to death with a two-year reprieve by the Jilin Intermediate People’s Court for embezzlement and abuse of power. The court also imposed a lifelong revocation of his political rights and the confiscation of all personal assets.

Hiwin Technologies, a prominent Taiwanese manufacturer of precision components, is intensifying its presence in the fast-growing fields of artificial intelligence and robotics. The company, known for its production of harmonic reducers and ball screws, has broadened its operations to include fully integrated robotic systems. Hiwin has already secured a role as a key supplier to major robotics firms and is also developing AI-powered robots tailored to the needs of the logistics sector. The firm indicated that visiting clients in May were pleased with its progress, with small-scale orders expected to begin by the end of the year.

Huawei is now believed to operate at least 11 semiconductor fabrication plants across China, covering memory, logic, and foundry segments—underscoring its strategic shift toward becoming a fully integrated device manufacturer (IDM), similar to Intel or Samsung.