MediaTek introduced the newest member of its Dimensity flagship smartphone chip series on May 14, 2025, named the Dimensity 9400e. This chip features MediaTek’s advanced All Big Core architecture, which provides outstanding performance and energy efficiency for gaming, artificial intelligence, imaging, and connectivity for smartphone users. The first smartphones powered by the Dimensity 9400e are expected to launch later in May.

At the TSMC Technology Symposium 2025 on May 15 in Hsinchu, Taiwan, T.S. Chang, VP of Advanced Technology and Mask Engineering at TSMC, announced the company’s accelerated fab expansion plans. Previously, TSMC built an average of three fabs annually from 2017 to 2020, which increased to five each year from 2021 to 2024. In 2025, TSMC aims to construct nine new facilities, consisting of eight wafer fabs and one advanced packaging plant.

AI servers are emerging as a dominant revenue driver for leading ODM vendors in 2025, with Foxconn at the forefront of this trend. Despite lingering concerns about potential supply chain disruptions, Foxconn chairman Young Liu emphasized during an April 14 investor conference that AI servers are now in the mass delivery stage and are expected to generate over 50% of the company’s total server revenue this year.

In a notable breakthrough for global trade, senior officials from the US and China convened in Geneva, Switzerland, to discuss a preliminary trade deal. Both nations have agreed to substantial tariff reductions for 90 days, a move expected to relieve the PC components industry and gaming sector by stabilizing prices and alleviating ongoing supply chain disruptions.