Nan Ya Printed Circuit Board Corporation (Nanya PCB), a top Taiwanese IC substrate maker, cautioned that second-quarter earnings may miss forecasts, citing the sharp rise of the New Taiwan dollar and policy uncertainty surrounding President Trump’s proposed reciprocal tariffs. At the May 27 shareholders meeting, Chairman Chia-chau Wu noted that AI-related substrate demand has kept Taiwan’s capacity running at high levels, outperforming China, but rising currency pressures and trade tensions are now dragging on export sales.

Hygon Information Technology and Dawning Information Industry Co. (Sugon) announced a strategic merger on May 25, 2025, a move widely seen as aligning with Beijing’s agenda to consolidate its computing infrastructure and fast-track technological self-reliance. Hygon, valued at roughly CNY316 billion (US$43.95 billion), focuses on domestic CPUs and data processing units (DCUs), with five chip generations in use across finance, telecom, artificial intelligence, and enterprise data centers.

As global display technologies pivot toward thinner, lighter, and more flexible form factors — especially for automotive and smart device applications — Taiwanese glass processor Gtoc Optoelectronics is making a bold move into next-generation materials. The company announced a strategic expansion into the ultra-thin rollable glass cover market, positioning itself as a key supplier for high-end automotive displays and precision glass applications.

With artificial intelligence driving explosive demand for high-speed data transfer, optical communication technologies are advancing in lockstep. Foxconn’s Hon Hai Research Institute (HHRI), in partnership with National Taiwan University (NTU) and King Abdullah University of Science and Technology (KAUST), has unveiled a breakthrough in multi-wavelength micro-LED (μ-LED) technology.