Taiwan academia advances next-gen interconnects with chiplets and silicon photonics

As Taiwan maintains its global leadership in semiconductor manufacturing, the nation’s academic institutions are stepping up efforts to address critical industry challenges such as physical scaling limitations and escalating development costs. By advancing research in chiplets and silicon photonics (SiPh), academia is playing a pivotal role in shaping the future of high-speed interconnect technologies.

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涉两起重大诉讼 翰博高新遭追讨1.78亿工程款

据上海证券报·中国证券网,近日翰博高新及其两家全资子公司涉及两起重大诉讼案件,原告方均为陕西建工第一建设集团有限公司。根据翰博高新于7月22日发布的公告,两起案件合计涉案金额约1.78亿元,公司及涉事子公司作为被告已收到法院传票及相关诉讼材料,案件目前处于法院已受理但尚未开庭审理阶段。

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BOE(京东方)正式确立“AI工厂”

7月28日,2025世界人工智能大会暨人工智能全球治理高级别会议(WAIC2025)期间,由中国工业互联网研究院与BOE(京东方)联合主办的“AI赋能新型工业化”主题论坛圆满落幕。论坛上,BOE(京东方)在显示行业首次确立“AI工厂”,不仅加快人工智能赋能新型工业化步伐,更为构建现代化工业体系注入数智化变革的澎湃动力。

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