AI server boom runs into fiberglass bottleneck

As the four major cloud service providers (CSPs) actively invest in self-developed application-specific integrated circuits (ASICs), market forecasts predict a rapid increase in shipments in 2025. However, the integrated circuit substrate supply chain has indicated concerns over potential upstream material shortages following reports that Japan’s leading fiberglass cloth manufacturer Nittobo is facing high-end production capacity constraints. This could potentially hinder future server shipments.

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China gains ground on Taiwan’s OSAT dominance amid pricing revolt

Taiwan continues to dominate the global outsourced semiconductor assembly and test (OSAT) market, but China is catching up quickly. Driven by state-backed chip self-reliance efforts, China’s OSAT industry has expanded at pace, steadily closing the market share gap across the Taiwan Strait. A recent industry-led initiative gaining traction in China is also pushing back against cutthroat pricing that has undermined profitability.

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SK Group chairman meets OpenAI CEO Sam Altman to deepen AI, HBM ties

SK Group chairman Chey Tae-won recently visited OpenAI’s headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil Business Newspaper and Yonhap News Agency. The visit marks the third known encounter between the two executives, following previous meetings in Seoul in February 2025 and San Francisco in June 2024.

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