PC pioneer FICG retools for the AI age with optical module surge
Semco to start mass production of AI-use ABF substrates and trial production of glass substrates in 2Q25
MediaTek’s AI chip blitz catapults ASE to a year’s worth of packaging tool orders in one quarter
Barcelona rises as Europe’s strategic tech investment nexus as US-China rift widens
Lip-Bu Tan’s Intel: leaner, flatter, and betting big on packaging
Intel is undergoing its most sweeping transformation in decades under new CEO Lip-Bu Tan, who is steering the company away from the ambitious—but turbulent—era of Pat Gelsinger. Since taking the helm in early 2025, Tan has moved quickly to flatten Intel’s management structure, tighten focus on customer needs, and realign the company around software-driven, AI-centric chip development.
Samsung’s delayed Texas chip plant faces leaner tax deal and hard 2026 cutoff
China’s 28nm foundry capacity to hit 31% by 2027 as SMIC, HLMC, Nexchip ramp up
China is rapidly expanding mature-node chip production at key sites, including SMIC’s fabs in Beijing, Shenzhen, Shanghai Lingang, and Xiqing; Hua Hong Semiconductor’s phase-two 12-inch fab in Wuxi; Nexchip Semiconductor’s N3 facility; and the second-phase 12-inch project by Beijing Yandong Micro Electronic. With these ongoing investments, analysts estimate China’s global share of 28nm capacity could exceed 31% by 2027.
Taiwan’s surging currency puts pressure on exporters’ margins
The New Taiwan dollar (NT$) surged by NT$0.953 against the US dollar (US$) on May 2—an appreciation of nearly 3% in a single day. This marked the currency’s strongest single-day gain in more than three decades.