ASE to acquire AMPI in strategic bid to restructure 6-inch foundry ops, tap AI chip demand

ASE Holdings, a global leader in semiconductor packaging and testing, announced that its subsidiary ASE Test Limited will initiate a tender offer to acquire Advanced Microelectronic Products, Inc. (AMPI), a 6-inch wafer foundry based in Taiwan. The acquisition aims to restructure AMPI’s operations and support the company’s broader business overhaul.

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Hiwin assesses prospects for mass production of humanoid robots

Hiwin Technologies, a prominent Taiwanese manufacturer of precision components, is intensifying its presence in the fast-growing fields of artificial intelligence and robotics. The company, known for its production of harmonic reducers and ball screws, has broadened its operations to include fully integrated robotic systems. Hiwin has already secured a role as a key supplier to major robotics firms and is also developing AI-powered robots tailored to the needs of the logistics sector. The firm indicated that visiting clients in May were pleased with its progress, with small-scale orders expected to begin by the end of the year.

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US poised to approve deal permitting UAE to import 500,000 Nvidia AI chips yearly

The US has reached a preliminary agreement with the United Arab Emirates (UAE) that would allow the Gulf nation to import 500,000 advanced AI chips from Nvidia annually beginning in 2025, according to Reuters. The agreement is expected to support the UAE’s push to build critical data centers essential for advancing AI model development. Sources familiar with the matter suggest the agreement is expected to last until at least 2027, with the potential for an extension through 2030.

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MediaTek expands flagship smartphone chip line with Dimensity 9400e

MediaTek introduced the newest member of its Dimensity flagship smartphone chip series on May 14, 2025, named the Dimensity 9400e. This chip features MediaTek’s advanced All Big Core architecture, which provides outstanding performance and energy efficiency for gaming, artificial intelligence, imaging, and connectivity for smartphone users. The first smartphones powered by the Dimensity 9400e are expected to launch later in May.

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US-China tariff talks pause triggers currency volatility, pressuring Taiwan’s PCB sector

Taiwan’s PCB manufacturers are finding temporary relief as the US dollar strengthens following the suspension of US-China tariff negotiations, partially offsetting pressure from the New Taiwan dollar’s recent appreciation. However, industry players remain cautious as uncertainty around President Trump’s tariff policies continues to cloud the outlook for the second half of 2025.

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TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant

At the TSMC Technology Symposium 2025 on May 15 in Hsinchu, Taiwan, T.S. Chang, VP of Advanced Technology and Mask Engineering at TSMC, announced the company’s accelerated fab expansion plans. Previously, TSMC built an average of three fabs annually from 2017 to 2020, which increased to five each year from 2021 to 2024. In 2025, TSMC aims to construct nine new facilities, consisting of eight wafer fabs and one advanced packaging plant.

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