苹果葛越：过去5年公司在中国智能制造、绿色制造领域的投资高达200亿美元
苹果公司在全球主要的200家供应商中，有超过80%在中国设有工厂，中国智能制造的水平在全球处于领先水平。
17
Jul
17
Jul
链聚创新，智赢未来——康宁以材料科学之力共筑中国产业四十五载
尽管全球供应链弹性在当前环境下遭遇挑战，康宁期待在链博会这个促进全球供应链合作的平台，进一步携手各行业伙伴维护产业链、供应链稳定畅通，共同探索发展的新机遇。
17
Jul
Gigabyte GS27FC2 is a 240Hz SuperSpeed VA gaming monitor
Gigabyte GS27FC2 is a new gaming monitor built around a 27-inch Super Speed VA display with an FHD resolution and a 240Hz refresh rate. The screen covers 125% of the sRGB color space and delivers a typical brightness of 350 nits with an HDR10 certification. The static contrast ratio is 3000:1, and the monitor also supports 1 ms MPRT. Some of its gaming-centric features include GameAssist…
17
Jul
Siemens eyes Samsung’s IP weak spot—could it unsettle the Synopsys-Cadence duopoly?
In a strategic move to disrupt the duopoly of Synopsys and Cadence in the electronic design automation (EDA) market, Siemens is reportedly launching an intellectual property (IP) alliance aimed at advancing its position. The initiative specifically targets major players like Samsung Electronics.
17
Jul
China’s Wingtech reboots C-suite as it doubles down on semiconductors
Wingtech Technology announced on July 15 a sweeping leadership overhaul as it shifts its core strategy toward semiconductors, following the divestiture of its consumer electronics ODM business. In March 2025, under mounting US sanctions, Wingtech sold its entire ODM manufacturing unit to Luxshare Precision, marking a complete exit from the consumer electronics sector and a decisive pivot to semiconductor development.
17
Jul
Adata surges on memory boom, eyes AI and Biotech for next growth wave
Taiwanese memory module maker Adata Technology reported after-tax profit of NT$462 million (US$15 million) in June 2025, marking a dramatic turnaround from a loss in the same month last year. The figure is nearly on par with the company’s first-quarter earnings of NT$526 million, signaling continued momentum in 2025.
17
Jul
Malaysia’s states compete to lead national push in IC design
Malaysia is ramping up efforts to grow its domestic integrated circuit (IC) design industry, as key states such as Selangor, Sarawak, and Penang launch competing initiatives to position themselves as the country’s next semiconductor innovation hub.
17
Jul
Can GlobalFoundries’ MIPS move chip away at Arm’s edge AI dominance?
While Intel’s new CEO Lip-Bu Tan is still pondering how to find a path forward for its foundry business, US-based semiconductor foundry giant GlobalFoundries (GF) recently announced plans to acquire chip developer MIPS Technologies at an undisclosed price and enter the RISC-V processor market.
17
Jul
What killed China’s rising 5G chip hopeful? The untold collapse of Jian Wen Lu Semiconductor
Founded in 2016 by former Tokyo Seimitsu (Accretech) engineer Sheng Jinghao, Jian Wen Lu (Zhejiang) Semiconductor was once considered a standout contender in China’s push for 5G RF chip independence. Its mission: to bypass foreign patent restrictions and develop high-frequency filters, long viewed as a chokepoint in RF front-end design.
16
Jul
LG enters hybrid bonding tool race, challenging Samsung and Hanwha
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory (HBM) chips. Often described by industry insiders as the “dream tool” for future memory packaging, HB systems are seen as essential to boosting performance in AI and data-intensive applications.