SEMI appoints Tien Wu as new Chairman of international board of directors

The SEMI has announced the appointment of Tien Wu, Chief Operating Officer (COO) of ASE Group, as the new Chairman of its International Board of Directors. Wu will succeed Mary Puma, the Executive Advisor of Axcelis Technologies, in this prestigious role, where he will lead SEMI’s global operations, oversee its talent development programs, and work toward fostering the collaborative goals of the semiconductor industry community.

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Nvidia warns US chip curbs may boost Huawei in global AI race

On June 12, 2025, at VivaTech in Paris, Nvidia CEO Jensen Huang issued repeated warnings that tightening US restrictions on AI chip exports to China may backfire, accelerating the rise of Chinese tech giant Huawei and potentially undermining America’s leadership in the global AI ecosystem. Huang emphasized that cutting off access to advanced chips may force China to double down on domestic alternatives—and succeed.

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AMD and Andrew Ng advocate open AI ecosystem to empower global developers

At AMD’s Advancing AI 2025 event on June 13, AMD CEO Lisa Su and AI luminary Andrew Ng took the stage in a wide-ranging dialogue that emphasized the importance of democratizing AI through open ecosystems, developer empowerment, and broad access to computing resources. Their conversation underscored how AI is reshaping software engineering, education, and the job market—offering both immense opportunities and distinct challenges.

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Micron ships HBM4 to key customers, targets solid market share in 2025

As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron announced that its 12-layer stacked 36GB HBM4 samples have been delivered to multiple major customers. Utilizing the 1β DRAM process technology, mass production is expected to begin in 2026 to support customer growth on next-generation AI platforms.

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Foxconn’s strategic transformation: embracing AI and cloud collaboration with Google

At the Google Cloud Summit on June 12, Foxconn’s Information Officer, Kuo-chin Chang (transliteration), highlighted the company’s deepening collaboration with Google as part of its broader transformation strategy. Through AI-powered solutions, Foxconn is evolving from a manufacturing giant to a tech-driven innovator, aiming to redefine its position in the global supply chain. By leveraging Google’s cloud infrastructure, cybersecurity, and AI-driven data analytics, Foxconn is meeting its growing needs for enhanced global business management efficiency.

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Micron retires DDR4, but the market isn’t ready

The world’s top three DRAM manufacturers have confirmed a shift from DDR4 specifications to advanced process products. Following the announcements from two major South Korean memory makers regarding their DDR4 discontinuation schedules, Micron has officially notified customers that DDR4 will reach the end of life (EOL), with shipments expected to cease gradually over the next two to three quarters.

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