As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic about the potential of Panel Level Packaging (PLP) to take the baton. With its inherent advantages, such as transforming substrates from round to square, PLP is positioned to become the new mainstream technology for AI chip packaging.

Tan Aik-Hoon, Avnet’s South Asia & Korea President, highlighted the Johor-Singapore Special Economic Zone’s potential to boost regional economic development through complementary resources and expertise. Success may prompt Singapore to replicate this model across ASEAN, strengthening economic ties and global supply chain roles. This strategy leverages Singapore’s tech innovation and Johor’s manufacturing capacity to attract investments and enhance regional competitiveness.

4月25日，立讯精密发布2024年年报，2024年营业收入2687.95亿元，同比增长15.91%；归属于母公司所有者的净利润133.66亿元，同比增长22.03%；基本每股收益1.86元，同比增长20.78%。