Tai-Saw leverages frequency-component portfolio to expand into optical communications, LEO satellites and drones

As frequency-control components move toward higher frequencies and smaller form factors, Tai-Saw Technology is leveraging synergies across its diversified product portfolio to expand into optical communications, low Earth orbit (LEO) satellites and drone supply chains. Tight industry capacity and rising raw material costs, however, have extended lead times for some products to 10–12 weeks, prompting the company to gradually expand production.

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Three-tier humanoid robot architecture shift opens edge AI opportunities

The humanoid robot industry is converging on a “big brain, small brain” architecture, with AI compute shifting from the cloud to the edge, and even to hands, feet, and other endpoints. DIGITIMES Intelligence predicts that Nvidia’s CUDA will keep it dominant in the robot “big brain” layer for now, but automotive chipmakers and field-programmable gate array (FPGA) vendors can still target the “small brain” and endpoint edge-compute market to break into the humanoid robot ecosystem.

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Memory must adopt foundry model to fix AI inference bottleneck, says Korean scholar

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting South Korean industry watchers to call for a shift to a “memory foundry” model. Sungkyunkwan University professor Seokjoon Kwon said at the Nano Korea 2026 forum that memory makers must move from mass production to order-driven design tailored to customer needs.

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The AI investment race is building its own bust, BIS paper warns

The competitive race to dominate artificial intelligence is driving technology giants to over-build computing capacity by roughly half again more than is economically efficient — and the same contest, financed with debt and circular equity ties, is quietly manufacturing the conditions for a sector-wide bust. That is the central argument of a new Bank for International Settlements (BIS) working paper that puts formal numbers on a warning the institution has been sounding for weeks.

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ASML supplier Trumpf says South Korea EUV demand is growing faster than Taiwan’s

High-NA EUV lithography is becoming the semiconductor equipment industry’s next major battleground as demand rises for more advanced chips used in artificial intelligence, high-performance computing, and mobile devices. Trumpf, a key supplier to ASML, says higher laser power, faster tool output, and closer coordination with chip designers will determine how quickly the technology becomes mainstream.

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