Huawei’s HiSilicon debuts low-power Cat.1 chip to boost IoT reach

On July 10, 2024, Huawei’s chip subsidiary HiSilicon launched its first Cat.1 IoT communication chip — the Hi2131 — officially entering the fast-growing cellular IoT market, which sees annual shipments exceeding 200 million units. Based on 4G LTE, Cat.1 offers a cost-effective, power-efficient, and widely deployable solution for mid-to-low-speed data scenarios, including shared mobility, smart security, wearables, and mobile payment devices.

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Taiwan launches smart robotics talent program to compete with semiconductor sector

Taiwan is positioning robotics as a national growth engine, with Premier Cho Jung-tai naming it a top strategic priority alongside semiconductors and drones. To accelerate progress from hardware dominance to software-driven applications, the National Science and Technology Council (NSTC) will roll out a high-level smart robotics talent development program starting in 2026.

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JEDEC’s LPDDR6 sets new pace for mobile and AI memory with faster, leaner architecture

On July 9, 2025, the JEDEC Solid State Technology Association, the leading organization for microelectronics standards, introduced LPDDR6 (JESD209-6), its latest low-power DRAM specification. The new standard brings major advances in memory performance, power efficiency, and security, targeting mobile devices, edge AI, and high-performance computing. LPDDR6 marks a pivotal shift toward faster, leaner, and more secure DRAM technology.

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Taiwan looks to space for connectivity, but stays grounded by constraints

Taiwan’s government-backed low-Earth orbit (LEO) satellite initiative—part of its Beyond 5G (B5G) communications technology roadmap—is facing mounting challenges, with progress on planned satellite launches and communications testing now uncertain. Despite plans to deploy six experimental satellites, officials acknowledge that the program is unlikely to evolve into a commercially viable system.

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