Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory production. This strategic shift moves the industry beyond the traditional race to increase memory cell layer counts, focusing instead on architectural advances that improve performance, power efficiency, and scalability.

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Smartphone brands expand AI adoption to mid-to-high-end models to boost sales in 2H25

As the third quarter of 2025 kicks off, smartphone brands around the world are rolling out new models, hoping to rejuvenate the sluggish market as inflation, currency swings, and trade tensions continue to weigh on consumer demand. While the smartphone market continues to face challenges like product maturity, high market penetration, and extended replacement cycles, making it difficult to achieve strong overall sales momentum, it’s fortunate that generative AI has boosted the industry in recent years. Brands have progressively incorporated AI functionalities into their mid- and high-end models, which has helped sustain smartphone sales.

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