晶合集成筹划赴港IPO
8月1日晚间，晶合集成(688249)披露，为深化公司国际化战略布局，加快海外业务发展，进一步提高公司综合竞争力及国际品牌形象，同时充分借助国际资本市场的资源与机制优势，优化资本结构，拓宽多元融资渠道，公司正在筹划发行境外上市股份（H股）并在香港联交所上市。
04
Aug
04
Aug
三星Galaxy Z Fold 7在美销量超前代50%
8月4日消息，据彭博社报道，当地时间上周四，三星电子称美国消费者对其最新款高端折叠手机的反应热烈，销量较上一代提升了50%。
03
Aug
CHPT resumes new plant project amid growing AI chip test demand
Chunghwa Precision Test Tech (CHPT), a leading provider of semiconductor test interface products, has resumed a capacity expansion project to build a new plant in Taiwan, catering to strong demand from the AI sector.
03
Aug
US defense contractors deepen Taiwan ties as AI military applications expand
American defense technology companies are strengthening relationships with Taiwan’s tech sector as the Biden administration’s AI action plan signals increased military AI spending, potentially boosting demand for dual-use hardware and cybersecurity systems.
03
Aug
Ex-Cambricon chip architect takes major step at new venture with major angel backing
Former Cambricon Technologies CTO Liang Jun has taken a significant leap with his new venture. On July 30, Shanghai Fangqing Technology — where Liang now serves as CEO — announced it had raised several hundred million Chinese yuan in angel funding. The round was supported by top-tier backers, including the Strategic Investment Division of Xiaomi, Nio Capital, and Shanghai Lingang Holdings.
03
Aug
No need to reinvent the wheel: Taiwan pushes to standardize AI robots like PCs
Amid surging global demand for AI-driven robotics, Taiwan’s industry leaders are banding together to form strategic alliances aimed at capturing new opportunities, but success won’t come easy. Key challenges include the lack of standardized platforms and critical components, as well as unresolved issues around regulations, certification, and safety testing. While the move has been broadly welcomed, concerns persist over the execution gap between ambition and real-world complexity.
03
Aug
Tong Hsing bets on 800G and GaN to offset currency-driven profit slide
Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025. The company warned that a recent sharp appreciation of the New Taiwan dollar has resulted in foreign exchange losses. As a result, third quarter 2025 revenue is expected to dip slightly compared to the second quarter.
03
Aug
Taiwan advances silicon photonics as global market heads toward US$7.8 billion by 2030
Taiwan is positioning itself in the growing silicon photonics market through government investment and university research partnerships, as the technology becomes critical for artificial intelligence infrastructure and defense applications, with the sector expected to grow 25% annually.
03
Aug
Greatek sees 2Q25 growth but faces currency erosion; flip-chip capacity expansion to complete by 1H26
Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)’s invested testing and packaging subsidiary, Greatek Electronics, reported consolidated revenue of NT$8.218 billion (US$276.8 million) for the first half of 2025, marking a year-over-year increase of 10.1%. The utilization rate in the second quarter rose by 5% quarter-over-quarter, although the appreciation of the New Taiwan dollar and rising electricity costs impacted gross margin performance.
03
Aug
The subscription car: Industry’s next revenue frontier faces consumer revolt
The automobile is undergoing its most dramatic transformation since the assembly line. What was once a purely mechanical machine is rapidly evolving into a complex software-driven platform, fundamentally reshaping how the automotive industry creates and delivers value. At the heart of this shift lies the rise of the software-defined vehicle (SDV).